Areas of Technical Expertise
- Advanced electronic packaging materials including laminates, ceramics, underfill materials and solder
- Package fabrication technologies including metallization, sintering, molding
- Backside Metallization of Semiconductors
- Thin Film metallization including sputtering and evaporation
- Passive component construction
- Aluminum nitride, HTCC, LTCC materials systems
- Die bonding systems including AuSn, AuSi, solder and epoxy
- Material interface characterization and failure analysis
- Brazing and joining technology including lead-free solder
- Material microstructural characterization and analysis
- Thermal characterization and problem solving for electronic applications
