Industries Served:
RF and Microwave
CMC personnel have experience and expertise in electronic packaging technology for RF and Microwave Infrastructure applications
- Cellular base-station power amplifiers
- Microwave communication devices
- Packaging materials and processing for high frequency applications
Recent Projects in RF and Microwave
- Working with a leading edge advanced packaging material supplier to introduce a new generation of RF packages for cellular base-station applications(2006-2007)
- Supporting introduction to market of a new high frequency passive component technology with enhanced performance from 20-100 GHz (2006-2007)
