Recent Presentations and Publications
AuSn Die Attach
J.H. Harris and E. Rubel, Semiconductor International, September 2007
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"How Interfacial Structure Can Play a Key Role in Package Reliability"
J. Harris, E. Rubel and R. Olivar, IMAPS Phoenix Chapter, August 2007
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"Technology Evolution Case Study: Aluminum Nitride Ceramics for
Electronic Packaging"
ASU Polytechnic Campus Colloquium Series, September 2007
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Semiconductor Wafer Backside Metallization:
Die Attach for High Thermal Demand Applications
J. Harris, IEEE Tutorial April 2007
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"How Interfacial Structure Can Play a Key Role in Package Reliability"
J. Harris, E. Rubel and R. Olivar, IEEE Tutorial, November 2006
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"The Global Electronic Packaging Roadmap: The Drive to Lower Cost"
J. Harris and N. Leonardi, SEMICON WEST, July 2006
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"Material and Interface Impact on Package Thermal Performance"
J. Harris, E. Rubel and R. Olivar, MEPTEC Thermal Conference, February 2005
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