CMC Staff Biographies
At CMC, we bring you decades of experience in all of the following areas:
- high-level materials characterization
- failure analysis capabilities
- materials and process development
- reliability evaluations and 'test to failure'
- client-customized technical market studies for technology firms
- investor due diligence reports
Our success-and yours-wouldn't be possible without an extraordinary team demonstrating a unique skill base in both technology and technology business development:
Jonathan H. Harris: President
view bio >>Robert Tesch: Vice President, Engineering
view bio >>Erich Rubel: Principal Laboratory Analyst
view bio >>Rutulio Olivar: Analytical Engineer
view bio >>Tom Nemecek: Staff Engineer
view bio >>Gabe Carrasco: Senior Test Engineer
view bio >>Rudy Enck: Senior Scientist, Test
view bio >>Sedaj L. Tesch: Office Manager
view bio >>Jennifer Horton: Customer Service Manager
view bio >>
Dr. Harris has played a leadership role in the advanced ceramic materials and electronic packaging industry over the past 20 years.
Dr. Harris is currently the President of CMC Interconnect Technologies, a materials analysis and consulting firm which specializes in helping clients develop new materials and optimize manufacturing processes to improve throughput and yield. CMC Interconnect Technologies has a broad range of in-house material characterization capability including microstructural analysis (SEM), thermal analysis (Laser Flash Thermal Conductivity), Mechanical Characterization and Electrical Characterization. CMC also has an engineering staff with broad experience in materials development and volume manufacturing requirements. CMC's clients range from start-ups to Fortune 100 companies.
Prior to founding CMC Interconnect Technologies in 2003, Dr. Harris was President of CMC Wireless Components, a high thermal performance ceramic packaging company which served the telecommunications, optics, and medical industries. CMC Wireless Component's core technology was the ceramic material aluminum nitride (AlN). CMC Wireless developed a wide range of technology which allowed the successful utilization of AlN in packaging applications. These technologies included: production of high thermal conductivity substrates, development of a co-fired multilayer AlN materials set, thick film post-fire metallization of AlN, thin film metallization of AlN, and plating of AlN ceramics. CMC scaled up to produce approximately 2 million AlN based packages per year.
Prior to his involvement with CMC Wireless Components, Dr. Harris held various positions in the advanced ceramics industry. These included: Technology Director for Carborundum Microelectronics (Phoenix Arizona), Technical Leader of a Joint Technology Development Project between Carborundum Microelectronics and IBM Microelectronics (East Fishkill, NY), and Member of the Technical Staff at BP America (Cleveland Ohio).
Dr. Harris received his doctorate in Solid State Physics from Brown University (Providence, RI) in 1983. He is the author of over 50 publications and book chapters and has 20 US Patents.
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Robert J. Tesch is Vice President of Engineering at CMC Interconnect Technologies. CMC is a "technology solutions" company that provides "root cause" identification and resolution, analytical services, program management, and marketing research for clients focusing on advanced materials and all levels of electronic interconnection.
Robert (Bob) Tesch has over twenty years of experience in the electronic packaging manufacturing business. He has worked with both Alumina and Aluminum Nitride materials through all phases of processing from product design, process development, tape casting/ink formulations, greensheet processing, plating, reliability/quality and critical path resolution.
Bob's professional record includes solid technical and scientific experience with CMC Wireless Components, Carborundum Microelectronics and the Unisys Corporation. Bob has directed engineering teams in the successful development and qualification of many product lines and technology transfer to a manufacturing site in S.E. Asia. Bob has a strong understanding of project and program management and the critical aspects of materials design, characterization, and documentation.
Bob received his MS in Ceramic Engineering from Iowa State University in Ames, Iowa with a BS background in Physics and Mathematics. He belongs to the American Ceramic Society.
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Erich has more than 20 years of experience working in Quality, R&D, and Failure Analysis laboratories serving the Electronics and Aerospace industries. An accomplished microscopist, Erich gained extensive familiarity with advanced materials and processes while working at Honeywell, Inc. and later at CMC Wireless Components. His educational and technical focus spans the fields of Chemistry, Metallurgy, and Materials Science. Serving as Analytical Services Engineer, Erich currently manages the SEM and Metallurgical Laboratories at CMC Interconnect Technologies.
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Rutilio earned his Aerospace Engineering degree at Arizona State University specializing in advanced conceptual design of mechanical and aerospace systems. Rutilio draws his experience from R&D and Failure Analysis in both the Aerospace and Medical industries applying his knowledge of advanced materials and processing in the areas of design, reverse engineering, and failure analysis. Rutilio serves as the Mechanical FA Engineering at CMC Interconnect Technologies.
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Tom has extensive experience in the development of ceramic materials, including AlN based products. Tom was part of the original team that developed the AlN substrate process that led to more advanced mutilayer packaging designs. Tom earned an M.S. in Solid State Physics at John Carroll University and has worked in material science related industries.
Tom applied his high temperature furnace knowledge toward understanding of sintering and brazing mechanisms. His team produced an AlN substrate that had the highest thermal conductivity in the industry. Currently, Tom's duties as CMC Interconnect Technologies include failure analysis and support for the co-fire ink requirements of our AlN licensees.
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Drawing from more than ten years experience in testing ceramic packaging, Gabe has the knowledge, experience, and judgment needed to apply measurements in the most effective manner. Gabe held key technical and management positions while serving with Carborundum and CMC Wireless Components, starting with Senior QA Technician and advancing to Test Engineer, Manufacturing Manager, and then Vice President of Operations. For CMC Interconnect Technologies, Gabe serves as the Test Engineer overseeing the Environmental, Thermal and RF/Electrical testing.
Back to Top ˆDr. Enck has had extensive experience in the measurement and development of electrical, electro-photographic, and thermal properties of advanced materials over the past 35 years. He has worked in the advanced packaging, medical, and electro-photographic industries. He has been a leader in the development of new measurement techniques that have addressed unsolved problems in these fields.
Dr. Enck is currently Principal Scientist, Electrical and Thermal Analysis, of CMC Interconnect Technologies, where he is responsible for electrical, thermal, and optical analyses. This work has included dielectric breakdown measurements, low frequency and microwave frequency dielectric characterization of packaging materials and devices, and thermal conductivity and thermal resistance measurement of packaging materials, devices, and thermal interface materials.
Prior to his involvement with CMC Interconnect Technologies, Dr. Enck held various positions in the advanced material and failure analysis industries. These included senior technical positions at Medtronic Failure Analysis Laboratory, Carborundum Microelectronics, BP America Research Laboratory, Xerox Research Laboratory, and IBM Research Laboratory. His focus in these positions has been development and characterization of new materials and devices, and development of new characterization techniques critical to material development.
Dr. Enck earned his doctorate from Syracuse University in 1967 in Physics, with a focus on optical and transport properties of semiconductors. He continued his semiconductor studies as a Post-Doctoral Research Associate at Purdue University.
Back to Top ˆJennifer Horton brings over 10 years of administrative and customer service management experience to the position of Customer Service Manager at CMC.
Prior to joining CMC, Jennifer worked at Nextel Communications. As Sales Coordinator, Jennifer's primary focus was that of liaison between the internal sales organization and the customer ensuring complete customer satisfaction. Jennifer brings strong communication, problem solving and account management skills to her position at CMC. Jennifer holds a Bachelor of Science Degree in Business Management.
Jennifer's key responsibility at CMC is to interface with local, national and international customers. Jennifer is also involved in support of the marketing programs at CMC and other internal projects.
Back to Top ˆAs Office Manager, Sedaj Tesch has over ten years of experience in both customer service management and business accounting in the electronic packaging industry. Sedaj currently manages CMC's accounting and human resources department. Prior to her work at CMC Interconnect Technologies, Sedaj held the position of Customer Service Manager for the Carborundum Company in Phoenix, Arizona. Sedaj was responsible for the supervision and direction of the Customer Service Department for four (4) national and international manufacturing sites.
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