Technology Services:

Aluminum Nitride Technology for License

Co-fired, multilayer Aluminum Nitride Process License CMC Interconnect Technologies is one of a few companies in the world that have developed the technology required to produce co-fired, multilayer aluminum nitride ceramic.

CMC has developed fabrication processes to produce packages with as many as 20 metallization layers within a high thermal conductivity ceramic. Thermal conductivities of 190 W/m-K (minimum) are routinely achieved with this technology. Thousands of metal vias may be incorporated within the package to provide electrical interconnect between metal layers.

CMC's co-fired AlN process has been successfully scaled up and is a production ready technology. In addition, packages using this technology have been extensively tested for reliability and have been used in a wide range of applications for over 10 years. These field tested applications include: commercial RF infrastructure, military telecommunications, avionics, commercial optics, industrial equipment, and other demanding uses.

CMC's co-fire multilayer ceramic fabrication process may be combined with cavity formation processes and thin film surface metallization, brazing of pins, leads and/or flanges and plating to produce a fully functional, high performance electronic package.

CMC offers non-exclusive licenses to all of the technology to produce co-fired aluminum nitride packages. Core technology areas available for license include:

Co-fired AlN Processes. All of the formulation and processing know-how required to manufacture co-fired, multilayer aluminum nitride packages. Process technology includes: formulations, furnacing conditions and cycles, qualified vendors and suppliers, processing conditions and SOPs, quality checkpoints and maintenance procedures. CMC also provides specifications for critical equipment and can help clients locate equipment if required.

Cavity Technology. Procedures and process know-how to incorporate single or multiple cavities in AlN based packages.

Thin Film Metallization of AlN Ceramics. Formulations and ceramic pre-treatment procedures to apply a robust thin film metallization layer on AlN ceramics with outstanding adhesion. This thin film layer may be brazed using high temperature CuAg hard solder or pure Ag with excellent results. This thin film layer was also designed to be plated with Ni, NiCo followed by Au or other plating compositions.

For licensed technology, CMC provides*:

Documentation for all formulations and processes
Specifications for required equipment and assistance in equipment procurement
On-Site training
Ongoing on-site and analytical technical support as required
These services are provided worldwide

* 5 days of training are included in the license fee. Ongoing project support in excess of this included training is part of a separate consulting agreement between CMC and each licensee.