Technology Services:
Failure Analysis and Materials Characterization
Analysis and Characterization Capabilities
- IC Interconnect Analysis (SEM, Optical Imaging)
view image - Package deconstruction analysis (X-ray Radiography, SEM, Optical Imaging)
view image - Interfacial structure (SEM, Optical Cross-sections)
view image - Elemental analysis and mapping (SEM, EDS)
- Microstructure and phase analysis (SEM, EDS)
- Grain structure, grain size distribution (SEM, image analysis)
- Failure interface identification (SEM, EDS, Optical cross-sections)
view image - Micro-hardness characterization of materials and layers (SEM)
- Thermal conductivity (Laser Flash)
- Heat capacity (Laser Flash, Calorimetry)
- Interfacial thermal resistance (laser flash)
- Electrical resistivity of metallization systems (4 point probe)
- Dielectric breakdown voltage
- Dielectric loss and dielectric constant of electronic materials and structures up to 26GHz (Network analyzer)
- Surface roughness (Laser profilometer)
- Surface curvature (Laser or stylus profilometer)
- Wirebond pull strength
- Stress/strain behavior of materials (Instron mechanical tester)
- Lead pull strength (Instron mechanical tester)
Analysis Equipment
- Scanning Electron Microscope
- EDS
- X Ray Radiography
- High Resolution Optical Microscopes
- Micro Hardness Tester
- Image Analysis Software
- Metallographic Laboratory
- Laser Profilometer
- Instron Mechanical Tester
- Hermeticity Tester
- HAST
- T Cycle Unit
- Temperature/Humidity Chamber
- Laser Flash Thermal Conductivity
- Electrical Conductivity
- Electrical Isolation/Dielectric Breakdown
- Capacitance Meter
- Thermal Imaging (IR Camera*
- Network Analyzer*
- Atomic Force Microscopy*
- Acoustic Microscopy*
- Auger Spectroscopy*
- FTIR and ATR*
- XPS/SIMS*
- UV/Vis Spectroscopy*
- TGA/TMA*
- DSC*
- GC and Mass Spectrometer*
* With CMC partner laboratories (CMC manages all tests)
