Technology Services:
Product and Process Development Capabilities
- Plating process development with specific expertise in Au, Ni, NiCo
and Cu Plating
- Thin film metallization development
- Re-work procedures for high value ceramic multilayer substrates
and manufacturing
- Joining technology and furnace profiles for optimum interfacial microstructure
- Solder bumps/ UBM interface
- Reflow for solder assembly processes
- Die bonding process optimization including AuSn, AuSi and epoxy
die attach technologies
- Cleaning and chemical modification procedures
- Thick film metal paste development and manufacture
- Automation System Development
