Technology Services: Recent Projects
- Evaluated the metallization scheme on a solar concentrator product for a international solar cell manufacturer to help optimize the process consistency and manufacturability of the product line. (2008)
- Provided a license for CMC's co-fired multilayer Aluminum nitride technology to a large European based electronics company. (2008)
- Provided microstructural analysis and technical consulting support to a large Asian hybrid assembly foundry to determine the interactions of thick film metallization and resistor pastes during processing. Worked with the client to determine the root cause of processing related defects and to clearly delineate the beneficial and detrimental interactions that can occur in these complex material systems to optimize process windows. (2007, 2008)
- Provided detailed microstructural analysis to the product development team in a large packaging foundry to assist in the development of new, highly miniturized laminate package fabrication technology. (2007, 2008)
- Helped a optoelectronic device manufacturer evaluate various silicon backside plating approaches and plating tool options for a highly non-standard application. Assisted this client in writing a plating tool specification and evaluating various plating tool vendors. (2007)
- Worked with a client who had previously licensed CMC's multilayer AlN technology to develop a novel heater focussed on medical applications. This involved development of a high temperature resistant coating that was bio-compatible and highly reliable. (2007)
- Performed a microstructural evaluation of a new wafer backside metallization multilayer stackup for a large optoelectronics component supplier. Evaluated the interaction between various metallization layers to determine reliability of the metallization. (2007)
- Perform failure analysis on a thick film hybrid circuit to determine the root cause of a metallization adhesion failure observed after wirebonding. Worked with the client to determine processing condition which were the source of this adhesion issue. (2007)
- Performed a large scale statistical electrical evaluation of a military component after subjecting the component to environmental stress. Set up an automated test system to capture intermittent failures. (2007, 2008)
- Backside metallization development for a silicon based optical device used in a high volume consumer application. (2007)
- Chemical and microstructural characterization of high density next generation organic circuit board patterns for a major subcontract assembly house. (2007)
- Extensive deconstruction project of a processor board which included all interconnect layers and characterization of all material. (2007)
- Performed an electronic reliability and failure mode evaluation of a PCB assembly used in a hand held medical device. (2007)
- Plating process optimization and yield improvement for an Opto-electronic package in a high thermal demand application. (2007)
- Working with a leading edge advanced packaging material supplier to introduce a new generation of RF packages for cellular base-station applications. (2006, 2007)
- Licensed CMC technology for a proprietary ceramic component used in a surgical implement. (2007)
- Measured using Laser Flash Thermal conductivity a TIM bonded multilayer structure to probe the consistency of the material in a production environment. (2007)
- Failure analysis and process optimization of an LTCC package used for a radar application. (2006, 2007)
- Packaging material and process fabrication support for a laser diode application used in fiber optic telecommunications. (2007)
- Construction analysis of critical passive components supplied to a major medical device fabricator. (2007)
- Support of a large package supplier to the hybrid industry with CSAM/TSAM and reliability testing of populated, overmolded ceramic packages. (2007)
- Identification of the cause of staining and poor adhesion of a metal base used in an optical imaging and display system for a large subcontract assembly house. After the root cause was determined, process improvements were developed and tested. (2007)
- Supporting introduction to market of a new high frequency passive component technology with enhanced performance from 20-100 GHz. (2006, 2007)
- Packaging evaluations for a major medical imaging system manufacturer and their subcontract assembly house. (2007)
- Identification of particle contamination on sensitive optical components via SEM and EDS. Particle source identification is a vital part of yield improvement for this aerospace customer. (2007)
- SEM characterization of gold-gold wirebond interfacial failures in order to determine the root cause failure mechanism on a high frequency ceramic package. Recommended process improvements were made based on the results. (2007)
- Extensive deconstruction project of a processor board which included all interconnect layers and characterization of all material. (2007)
- Optimization of a high volume gold plating process for enhanced die attach and wirebondability. (2006)
- Characterization of a thin intermetallic compound (IMC) layer which influenced reliability of lead-free solder balls for a flip chip device. Recommendations on processing conditions to frustrate the formation of this IMC layer. (2006)
- Development of an optimum under bump metallization (UBM) system for AuSn die attach. (2006)
- Defect identification and process window optimization for a high volume Cu plating process which improved plating yield from 60% to 96%. (2006)
- Licensed and provided technology transfer support for co-fired multilayer aluminum nitride technology to a customer in China. Multilayer ALN parts were fabricated within 5 months of project initiation. (2006)
- Reclaim of a multilayer ceramic package saving the customer $400,000. (2006)
- Developed a Ni plating process for a customer with specific mechanical and optical properties. (2006)
- License of CMC AlN ceramic technology to key military package and assembly house and ongoing support to this customer. (2004, 2007)
